PRODUCT TECHNOLOGY
Bare Board

KQ-LC-01 PU FOAM

Product description

 

  Kq-lc-01 rigid foam polyurethane insulation board has the characteristics of small bulk density, high strength, convenient and fast construction, small water absorption, good dimensional stability at low or high temperature, long service life, good adhesion, excellent thermal insulation performance, etc., which is widely used in petroleum, chemical industry, construction, packaging, refrigeration, military industry, aerospace, aviation, transportation, industrial modeling design, etc.

 

   Thermal insulation is one of the most important properties of thermal insulation materials. The thermal conductivity of kq-lc-01 rigid foam polyurethane board produced by the company is about 0.02 w / (m.k), which is the lowest among organic thermal insulation materials.

 

 Relevant indicators

 

Serial number

Item

Index

1

DensityKG/m³)

35

2

Compressive   strengthKPA

150

3

Thermal   conductivityw/(m*k)

0.024

4

Oxygen index(%)

26

5

Water absorption(%)

3

6

Dimensional   stability(%)

70℃≤2.0


-30℃≤1.0